Commodity Name: Aluminium Substrate Printed Circuit Board for Automotive

Place of Origin: Jiangsu, China

Brand Name: HFast

Base Material: Aluminum

Layers: 3L(1 Aluminium layer + 2 Parallel Layers)

Board Thickness: 1.60mm

Minimum Hole Size: 0.25mm

Minimum Line Width: 0.20mm

Minimum Line Spacing: 0.20mm

Surface Treatment: Gold Plating

Color: Black Oil and White Legend

Surface Treatment: Gold Plating

Advantages: Automotive aluminum based hybrid pressure plate, high heat dissipation LED

Brief Introduction of Aluminium Substrate PCB

Aluminum based PCB (Metal Core PCB, MCPCB ) is a printed circuit board designed specifically for high-power and high heat generating electronic devices, using metal aluminum as the heat dissipation substrate. Its core value lies in its excellent thermal conductivity (about 10 times that of FR-4), which is widely used in fields such as LED lighting, power modules, and automotive electronics.

Aluminum based PCB is a master of balancing thermal management and cost control

-Cost effective King: In medium power scenarios with thermal conductivity requirements of 1-5W/(m · K) (accounting for 70% of the heat dissipation PCB market), the cost is only 1/5 of copper substrates;  

-Technological Evolution:

-Nano insulation layer: Boron nitride (BN) filling enhances thermal conductivity to 8W/(m · K);  

-Structural innovation: AlSiC substrate solves the problem of thermal expansion mismatch;  

-Integration: Aluminum substrate embedded with heat pipes/temperature equalization plates (VC), reducing thermal resistance by 50%.  

>The essence of choosing aluminum based PCB is to choose thermal reliability, when every 1 ℃ temperature rise is related to the system life, the metallic light of aluminum is the life defense line of electronic devices.

Characteristics of Aluminum Core PCB

1. Excellent heat dissipation performance;

2. High current carrying capacity and electrical performance;

3. Mechanical and physical properties;

4. Environmental friendly and cost effective.

Three layer structure of aluminum based PCB

|* * Circuit layer * * | Electrolytic copper foil (1~10oz) - carries electronic components and wiring | Line width/spacing ≥ 0.2mm (to avoid uneven etching)|

|* * Insulation layer * * | Thermal conductive epoxy resin/ceramic powder filling (50-200 μ m) - Electrical isolation+thermal conductive bridge | Thermal conductivity coefficient>1.5W/(m.K), withstand voltage>4kV|

|* * Metal substrate * * | Aluminum alloy (6061/5052) - quickly conducts heat away | Thickness 1.0~3.0mm, surface anodized anti-corrosion|

Insulation layer selection :

High thermal conductivity type: filled with aluminum nitride (thermal conductivity>2.5W/(m.K)), used for laser/IGBT modules;  

Cost effective type: filled with alumina (thermal conductivity of 1-2W/(m · K)), universal LED lighting;  

High frequency type: Low dielectric constant resin (Dk=3.5), suitable for RF power amplifiers.

Key manufacturing processes of aluminum based PCB

1. Insulation layer treatment

-Ceramic powder mixture: epoxy resin+70% Al2O3/AlN powder to ensure thermal conductivity and insulation balance;  

-Semi cured sheet compression: 110℃ pre compression → 170℃ final compression (pressure 15kg/cm²) to eliminate bubbles.

2. Aluminum based drilling

-Step drill: First, the small drill bit penetrates the copper layer, and then the large drill bit expands the aluminum layer (to prevent burrs);  

-Coolant control: Avoid aluminum shavings from oxidizing and contaminating the hole wall.

3. Surface treatment

|Craftsmanship  | Applicable Scenarios | Advantages | Limitations|

|HASL (Spray Tin) | Ordinary power device | Low cost, high solder strength | Poor flatness (>0.1mm)|

|ENIG Precision SMD Components (such as COB LEDs) | Ultra flat Surface (<5 μ m) | High Cost|

|Anodizing | Non welding area protection | Wear and corrosion resistance | Insulation non weldable|

The Golden Rule of Design of Aluminum Substrate PCB

1. Hot optimization layout

-High heat generating devices (such as MOSFETs) are placed in the center to shorten the thermal path;  

-Do not open windows below the power components to ensure the integrity of the thermal conductivity channel.  

2. Mechanical reinforcement

-Reserve a copper free area of ≥ 3mm around the screw fixing hole (to avoid short circuits);  

-Add reinforcing ribs to the edge of the board (required when the thickness of the aluminum base is ≥ 2mm).  

3. Electrical safety

-High voltage lines (>100V) with a spacing of ≥ 0.5mm/kV;  

-The withstand voltage of the insulation layer should be at least twice the working voltage (such as selecting>4kV for AC 220V applications).