Commodity Name: Heat-conducting Glue Printed Circuit Board for POS Machine

Brand Name: HFast

Layers: 2L

Board Thickness: 1.60mm

Minimum Hole Size: 0.30mm

Minimum Line Width: 0.30mm

Minimum Line Spacing: 0.30mm

Surface Treatment: Lead free tin spraying+thermal conductive adhesive

Color: Green Oil and White Legend

Advantages of Heat-conducting Glue PCB

Thick copper 2oz+thermal conductive adhesive. The main characteristic of thermal conductive adhesive HSP is to replace traditional metal thermal conductive sheets and play a role in heat dissipation; Simplify the production process and achieve any shape of graphics through screen printing. The production of thermal conductive adhesive provides excellent heat transfer effect for the heat dissipation of circuit boards, making electronic products more stable during use and extending their service life.

Brief Introduction of Heat-conducting Glue PCB

Thermal conductive adhesive is a type of adhesive specifically designed to establish an efficient heat transfer path between heating elements and heat sinks, while providing reliable bonding (mechanical fixation)

Thermal conductive adhesive is an advanced material that combines efficient heat conduction and reliable structural bonding. It plays a crucial role in modern electronic devices, especially in fields that require high power density and high reliability, such as LED, automotive electronics, power supplies, and computing. Choosing the appropriate thermal conductive adhesive requires comprehensive consideration of multiple factors such as thermal conductivity, mechanical performance, electrical performance, processability, cost, and long-term reliability.

Core Functions of Heat-conducting Glue PCB

Thermal conduction: This is the most important function. It can effectively transfer the heat generated by electronic components (such as CPUs, GPUs, power transistors, LED chips, power modules, etc.) during operation to heat sinks (such as heat sinks, fins, and casings), thereby reducing the operating temperature of the components, preventing overheating damage, and improving device reliability and lifespan.

*Mechanical bonding/fixation: Unlike thermal conductive silicone grease (which only fills gaps and does not provide adhesive strength), thermal conductive adhesive has structural bonding strength after curing. It can firmly bond heating elements and heat sinks together, providing mechanical support and fixation to prevent components from shifting or falling off under vibration or impact. This simplifies the assembly structure (sometimes eliminating mechanical fasteners such as screws and buckles) and improves production efficiency.